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2022-08-09
Feed Overlap Detection | MDSC-1000L for Thermal Pad Feeding in Chip Assembly
Project Background:
High-density 5G chip assemblies require thermal pads (approx. 11×10×0.23 mm composite sheets). The customer needs reliable single/double-sheet detection on the placement conveyor to avoid missing or double-fed pads.
Solution:
Deploy Atonm MDSC-1000L double-sheet detector with M8 ultra-small probes to continuously monitor pad feed. When zero or double pads are detected, the system notifies the host to bypass the placement station. MDSC-1000L is tuned for thin composite materials and supports a wide thickness range for metals and composites.
